What's the difference between XRing O1 and XRing O3?

Why skip O2? XRing O3 represents an architectural shift — eliminating the "big" core tier and simplifying from four tiers to three, with a notable clock speed increase across all tiers and a 25% GPU performance boost. The O3 naming may indicate O2 was reserved for tablets or that XRing uses its own unique versioning.

Why is the XRing O3 China-exclusive only?

The strategy mirrors what Xiaomi did with the 15S Pro. Launching the in-house chip first in the Chinese market lets Xiaomi test it in a controlled environment before risking an international rollout.

Can XRing O3 compete with Snapdragon 8 Elite Gen 6 or Apple A20?

Xiaomi's custom silicon aims to compete with Apple and Qualcomm's flagship chips. Prime cores at 4.05GHz and a 25% GPU boost are positive indicators, but real-world comparisons require actual benchmark testing.

When is the official announcement expected?

The Xiaomi 18 series, including Ultra, is expected to be presented in China around September or October 2026, with a possible global release later in 2026 or early 2027. The XRing O3 variant specifically is expected in December.

Will Xiaomi eventually use XRing across all its phones?

Not soon. Xiaomi still relies on Snapdragon and Dimensity for the vast majority of its lineup. In-house chips currently target select flagship models as a statement to the market that Xiaomi is capable of competing in semiconductor development.

Xiaomi 18 Ultra with In-House XRing O3 Chipset — 4.05GHz Prime Cores, 25% GPU Boost and China-Only Launch in December 2026

Xiaomi Deepens Its Chip Ambitions — XRing O3 Headed for the 18 Ultra

About a year ago, Xiaomi introduced the Xiaomi 15S Pro, its first phone powered by an in-house chipset called the XRing O1. This was a variant of the Xiaomi 15 Pro, which originally ran on a Snapdragon 8 Elite. The company may be looking to do something similar this year, reports Yogesh Brar — the scuttlebutt is that there will be a version of the Xiaomi 18 Ultra powered by the XRing O3.

XRing O3 — What We Know About the Chip

The XRing O1 had an interesting four-tier CPU structure with two Cortex-X925 cores, two Cortex-A725 cores, then four lower-clocked A725 cores, and two Cortex-A520 cores — labeled "prime," "titanium," "big," and "little."

For the XRing O3, Xiaomi will do away with the "big" tier entirely. Looking at the planned clock speeds, it seems more accurate to say that the "little" tier will be taking over the role of the "big" tier.

Leaked XRing O3 Clock Speeds (Codename "Lhasa")

Prime cores at 4.05GHz. Titanium cores at 3.43GHz. Little cores at 3.02GHz.

The new "prime" cores will crack the 4GHz barrier. The "little" cores will be clocked significantly higher than the old "big" and "little" cores. The GPU speed will be bumped by 0.3GHz — an increase of 25%. The GPU design is unknown but chances are it will be an ARM Mali G1-Ultra — the successor to the G925.

Memory and Technical Architecture

Memory speeds are tipped to remain at 9,600 MT/s. The chipset is internally known as Q18 with the codename "Lhasa."

Xiaomi's In-House Chip Strategy

By developing the XRing O3, Xiaomi is following a path similar to Apple's vertical integration with its A-series chips and Qualcomm's push for custom Oryon cores. Just as Apple optimizes its hardware for iOS, Xiaomi's shift toward proprietary silicon would allow for deeper integration with its camera hardware and AI tricks.

Timeline and Availability

The Xiaomi 18 Ultra with XRing O3 should arrive in December — and the company isn't planning on a global release for the XRing-based model, so it will be available only in China.

The XRing O3-powered device may be a separate offering from the Xiaomi 18 Ultra, raising questions about how Xiaomi plans to position the new model within its flagship lineup.

XRing O3 in Foldable Devices Too

Reports link the processor to what may launch as the Xiaomi Mix Fold 5 or Xiaomi 17 Fold in the second half of 2026. Xiaomi has stated plans to release a new version of its XRing chipset annually and to expand in-house silicon use beyond initial China-focused devices.