
Initial details about the vivo X Fold6 surfaced in November last year, suggesting it would feature a 200MP camera and the Snapdragon 8 Gen 5 chipset. However, a new leak now claims the foldable will instead be powered by the MediaTek Dimensity 9500 SoC.
vivo is expected to unveil the X Fold6 within the next two months. If the company follows its usual release cycle, the foldable could arrive in June.
According to tipster Digital Chat Station, the handset will sport an 8.02-inch UTG display with 2K resolution on the inside, and a 6.51-inch screen on the outside. That's not very different from the vivo X Fold5, which gets a 6.53-inch cover display and an 8.03-inch inner screen.
The inner panel is E8 AMOLED with a 120Hz refresh rate and 4,500-nit peak brightness.
The X Fold6 will feature a 200MP primary rear camera, accompanied by a 50MP periscope telephoto camera and a 50MP ultrawide unit. It is also said to include 20MP selfie cameras on both the inner and outer displays.
The foldable is tipped to pack a 7,000mAh battery with wireless charging support and a full water resistance rating — a feature missing from many foldable devices.
X Fold5 came with 5,700mAh — X Fold6 adds 1,300mAh in the same foldable body. Silicon-carbon technology is the enabler.
The device is expected to measure less than 9mm when folded — one of the most pocketable large-screen foldables ever produced. The new hinge mechanism utilizes aerospace-grade carbon fibre. Both inner and outer displays will feature 3D ultrasonic fingerprint scanners.
The first leak pointed to Snapdragon 8 Gen 5 — the more recent leak from Digital Chat Station corrects this to Dimensity 9500. The same pattern as X Fold5 which used Snapdragon 8 Gen 3 while Snapdragon 8 Elite was powering more expensive devices. Dimensity 9500 is a powerful chip but less costly than Snapdragon 8 Elite Gen 5 — allowing vivo to offer a more competitive price point.
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